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MC10EP32DTG

MC10EP32DTG

Manufacturer No:

MC10EP32DTG

Manufacturer:

onsemi

Description:

IC DIVIDER BY 2 1-BIT 8TSSOP

Datasheet:

Datasheet

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MC10EP32DTG Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3 V ~ 5.5 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-2
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    10EP
The MC10EP32DTG is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is part of the ECLinPS MAX family of devices and offers several advantages and application scenarios:Advantages: 1. High-speed operation: The MC10EP32DTG is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low jitter: It provides low jitter performance, ensuring accurate and reliable data reception even at high frequencies. 3. Differential signaling: The chip uses differential signaling, which helps in reducing noise and improving signal integrity, making it suitable for applications in noisy environments. 4. Wide operating voltage range: It operates over a wide voltage range, typically from -4.2V to -5.7V, allowing flexibility in various power supply configurations. 5. Small form factor: The chip comes in a small form factor package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10EP32DTG can be used in high-speed data communication systems, such as fiber-optic networks, where fast and accurate data reception is crucial. 2. Telecommunications: It can be used in telecommunications equipment, such as routers and switches, to receive and process high-speed data signals. 3. Test and measurement: The chip can be utilized in test and measurement equipment, such as oscilloscopes and logic analyzers, to capture and analyze high-speed digital signals. 4. Data center applications: It can be employed in data centers for high-speed data processing and transmission between servers and networking equipment. 5. Industrial applications: The chip can find applications in industrial automation systems, where high-speed data transmission and reliable signal reception are required.It is important to note that the specific application and implementation of the MC10EP32DTG may vary depending on the system requirements and design considerations.
MC10EP32DTG Relevant information