MC100LVEL33DR2G

MC100LVEL33DR2G

Manufacturer No:

MC100LVEL33DR2G

Manufacturer:

onsemi

Description:

IC DIVIDER BY 4 1-BIT 8SOIC

Datasheet:

Datasheet

Delivery:

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MC100LVEL33DR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3 V ~ 3.8 V
  • Trigger Type
    Positive, Negative
  • Count Rate
    4 GHz
  • Timing
    -
  • Reset
    Asynchronous
  • Number of Bits per Element
    2
  • Number of Elements
    1
  • Direction
    -
  • Logic Type
    Divide-by-4
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    100LVEL
The MC100LVEL33DR2G is a high-speed differential receiver integrated circuit chip. It is part of the MC10EL series of devices designed for high-performance telecommunications and data communications applications. Here are some advantages and application scenarios of the MC100LVEL33DR2G:Advantages: 1. High-speed operation: The MC100LVEL33DR2G operates at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low jitter: It has low jitter characteristics, ensuring accurate and reliable data reception. 3. Differential inputs: The chip has differential inputs, which provide better noise immunity and common-mode rejection, making it suitable for noisy environments. 4. Wide operating voltage range: It can operate over a wide voltage range, typically from -4.2V to -5.7V, allowing flexibility in different power supply configurations. 5. Small package size: The chip is available in a small package, making it suitable for space-constrained applications.Application scenarios: 1. Telecommunications: The MC100LVEL33DR2G can be used in telecommunications systems for high-speed data transmission, such as in optical networks, fiber-optic communication systems, and high-speed serial data links. 2. Data communications: It is suitable for high-speed data communication applications, including Ethernet, SONET/SDH, and other high-speed data interfaces. 3. Test and measurement equipment: The chip can be used in test and measurement equipment that requires high-speed data acquisition and processing, such as oscilloscopes, logic analyzers, and data acquisition systems. 4. Industrial automation: It can be used in industrial automation systems that require high-speed data transmission and processing, such as in control systems, robotics, and motion control applications. 5. High-performance computing: The chip can be used in high-performance computing systems that require fast data transfer between different components, such as in servers, supercomputers, and data centers.Overall, the MC100LVEL33DR2G integrated circuit chip offers high-speed, low jitter, and differential input capabilities, making it suitable for various applications that require fast and reliable data transmission and processing.