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SN74ALVTH162827GR

SN74ALVTH162827GR

Manufacturer No:

SN74ALVTH162827GR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SN74ALVTH162827GR Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.3V ~ 2.7V, 3V ~ 3.6V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74ALVTH
The MB91366GAPMCR-G-102-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with low power consumption, making them suitable for applications that require efficient processing. 2. Versatility: The chips support various communication protocols, including Ethernet, USB, and PCIe, making them suitable for a wide range of applications. 3. Scalability: The chips offer scalability options, allowing for easy integration into different systems and applications. 4. Security Features: These chips come with built-in security features, such as encryption and authentication, ensuring data integrity and protection. 5. Reliability: The chips are designed to be highly reliable, with features like error correction and fault tolerance, making them suitable for critical applications.Application Scenarios: 1. Networking Equipment: The chips can be used in networking equipment, such as routers, switches, and gateways, to provide high-speed data processing and communication capabilities. 2. Industrial Automation: These chips can be used in industrial automation systems, such as programmable logic controllers (PLCs), to enable efficient data processing and communication between different components. 3. Automotive Electronics: The chips can be used in automotive electronics, such as advanced driver-assistance systems (ADAS) and infotainment systems, to provide high-performance processing and connectivity. 4. Data Centers: These chips can be used in data centers to handle high-speed data processing and communication requirements, ensuring efficient operation and connectivity. 5. Internet of Things (IoT): The chips can be used in IoT devices, such as smart home appliances and wearable devices, to enable efficient communication and processing of data.Overall, the MB91366GAPMCR-G-102-BND integrated circuit chips offer high performance, versatility, and security features, making them suitable for various applications in networking, industrial automation, automotive electronics, data centers, and IoT.
SN74ALVTH162827GR Relevant information