74LVX245M

74LVX245M

Manufacturer No:

74LVX245M

Manufacturer:

onsemi

Description:

IC TXRX NON-INVERT 3.6V 20SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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74LVX245M Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2V ~ 3.6V
  • Current - Output High, Low
    4mA, 4mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Transceiver, Non-Inverting
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74LVX
The MB89637PF-GT-1284-BND is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89637PF-GT-1284-BND chip offers high processing power and performance, making it suitable for demanding applications. 2. Low Power Consumption: It is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Integrated Peripherals: The chip includes various integrated peripherals such as UART, I2C, SPI, timers, and PWM, reducing the need for external components and simplifying the overall design. 4. Ample Memory: It provides a sufficient amount of on-chip memory, including RAM and Flash memory, allowing for data storage and program execution. 5. Robust Connectivity: The chip supports multiple communication interfaces like USB, CAN, and LIN, enabling seamless connectivity with other devices or systems.Application Scenarios: 1. Industrial Automation: The MB89637PF-GT-1284-BND chip can be used in industrial automation systems for controlling and monitoring various processes, thanks to its high performance, integrated peripherals, and communication interfaces. 2. Automotive Electronics: It is suitable for automotive applications such as engine control units (ECUs), dashboard systems, or body control modules, where its robust connectivity options and low power consumption are advantageous. 3. Consumer Electronics: The chip can be utilized in consumer electronics devices like smart home systems, IoT devices, or wearable devices, benefiting from its low power consumption, integrated peripherals, and memory capabilities. 4. Medical Devices: Medical equipment and devices that require high processing power, connectivity, and memory can benefit from the features offered by this chip. 5. Communication Systems: The chip's communication interfaces, such as USB, CAN, or LIN, make it suitable for applications in communication systems, including data acquisition, data logging, or networked devices.It is important to note that the specific advantages and application scenarios may vary based on the requirements and specifications of the project or system in which the chip is being used.