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74ACT125PC Specifications
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TypeParameter
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Supplier Device Package14-MDIP
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Package / Case14-DIP (0.300", 7.62mm)
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Mounting TypeThrough Hole
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply4.5V ~ 5.5V
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Current - Output High, Low24mA, 24mA
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Output Type3-State
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Input Type-
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Number of Bits per Element1
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Number of Elements4
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Logic TypeBuffer, Non-Inverting
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PackagingTube
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Product StatusObsolete
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Series74ACT
The MB90022PF-GS-357 is a specific model of an integrated circuit chip, and its advantages and application scenarios can vary depending on the specific features and capabilities of the chip. Unfortunately, without more information about the chip, it is not possible to provide accurate details about its advantages and application scenarios.However, in general, integrated circuit chips are widely used in various electronic devices and systems. They can be found in computers, smartphones, televisions, automotive systems, medical devices, and many other applications. Integrated circuit chips provide numerous advantages, such as:1. Miniaturization: Integrated circuits allow for the miniaturization of electronic components, enabling the development of smaller and more compact devices.2. Increased functionality: Integrated circuits can integrate multiple functions and components into a single chip, reducing the need for external components and simplifying the overall design.3. Improved performance: Integrated circuits can provide faster processing speeds, higher data storage capacities, and improved power efficiency compared to discrete components.4. Cost-effectiveness: Mass production of integrated circuits can lead to cost savings due to economies of scale.5. Reliability: Integrated circuits are less prone to failures and malfunctions compared to discrete components, as they are manufactured using advanced fabrication techniques.In summary, integrated circuit chips like the MB90022PF-GS-357 offer various advantages and can be applied in a wide range of electronic devices and systems. However, specific details about the advantages and application scenarios of this particular chip would require more information about its features and specifications.
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