74LVCH322244AEC,51

74LVCH322244AEC,51

Manufacturer No:

74LVCH322244AEC,51

Manufacturer:

NXP USA Inc.

Description:

IC BUF NON-INVERT 3.6V 96LFBGA

Datasheet:

Datasheet

Delivery:

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74LVCH322244AEC,51 Specifications

  • Type
    Parameter
  • Supplier Device Package
    96-LFBGA (13.5x5.5)
  • Package / Case
    96-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.2V ~ 3.6V
  • Current - Output High, Low
    12mA, 12mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    8
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVCH
The 74LVCH322244AEC,51 is a specific integrated circuit chip that belongs to the 74LVCH family of logic devices. It is a 32-bit buffer/line driver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The 74LVCH322244AEC,51 chip operates at high speeds, making it suitable for applications that require fast data transfer and processing. 2. Low power consumption: This chip is designed to consume low power, making it energy-efficient and suitable for battery-powered devices. 3. 3-state outputs: The 3-state outputs allow multiple devices to share a common bus, enabling efficient data communication and control. 4. Wide operating voltage range: The chip can operate within a wide voltage range, making it compatible with various power supply configurations. 5. ESD protection: The chip provides Electrostatic Discharge (ESD) protection, ensuring its robustness and reliability in different environments.Application scenarios: 1. Data communication systems: The 74LVCH322244AEC,51 chip can be used in various data communication systems, such as networking equipment, routers, and switches, to buffer and drive signals between different components. 2. Memory systems: It can be used in memory systems to interface between the memory modules and the memory controller, ensuring efficient data transfer and signal integrity. 3. Industrial automation: The chip can be utilized in industrial automation systems, where it can buffer and drive signals between different components, such as sensors, actuators, and controllers. 4. Automotive electronics: Due to its high-speed operation and ESD protection, the chip can be used in automotive electronics applications, such as in-vehicle networks, infotainment systems, and control modules. 5. Consumer electronics: The chip can be employed in various consumer electronic devices, including smartphones, tablets, gaming consoles, and digital cameras, to facilitate data transfer and signal buffering.It is important to note that the specific application scenarios may vary depending on the requirements and specifications of the overall system design.