74LVCH16244ADL,112

74LVCH16244ADL,112

Manufacturer No:

74LVCH16244ADL,112

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 3.6V 48SSOP

Datasheet:

Datasheet

Delivery:

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74LVCH16244ADL,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-SSOP
  • Package / Case
    48-BSSOP (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.2V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    74LVCH
The 74LVCH16244ADL,112 is a 16-bit buffer/driver integrated circuit chip. Some of its advantages and application scenarios include:1. High-speed operation: The 74LVCH16244ADL,112 operates at a high speed, making it suitable for applications that require fast data transfer.2. Low voltage operation: It operates at a low voltage range of 1.65V to 3.6V, making it compatible with a wide range of low-power devices.3. Bidirectional data flow: The chip supports bidirectional data flow, allowing it to be used for both input and output buffering.4. Wide operating temperature range: It can operate in a wide temperature range, typically from -40°C to 125°C, making it suitable for various environments.5. ESD protection: The chip provides Electrostatic Discharge (ESD) protection, ensuring the safety of the circuit from static electricity.Application scenarios:1. Data communication: The 74LVCH16244ADL,112 can be used in data communication systems to buffer and drive signals between different components, ensuring reliable and fast data transfer.2. Memory systems: It can be used in memory systems to buffer address and data lines, ensuring proper signal integrity and preventing data corruption.3. Industrial automation: The chip can be used in industrial automation systems to interface between different components, such as microcontrollers, sensors, and actuators, ensuring proper signal levels and data transfer.4. Automotive electronics: Due to its wide operating temperature range and ESD protection, it can be used in automotive electronics for various applications, such as in-car communication systems, engine control units, and dashboard displays.5. Consumer electronics: The chip can be used in various consumer electronic devices, such as smartphones, tablets, and gaming consoles, to buffer and drive signals between different components, ensuring proper signal integrity and data transfer.