N74F245D,623

N74F245D,623

Manufacturer No:

N74F245D,623

Manufacturer:

NXP USA Inc.

Description:

IC TXRX NON-INVERT 5.5V 20SO

Datasheet:

Datasheet

Delivery:

Payment:

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N74F245D,623 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SO
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    3mA, 24mA; 15mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Transceiver, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74F
The N74F245D and 623 integrated circuit chips are commonly used for bus transceiver applications. Here are the advantages and application scenarios for these chips:Advantages: 1. High-speed operation: These chips are designed to operate at high speeds, making them suitable for applications that require fast data transfer. 2. Bidirectional data transfer: The chips support bidirectional data transfer, allowing data to be transmitted in both directions on the bus. 3. Voltage level translation: They can handle voltage level translation between different logic families, making them compatible with a wide range of devices. 4. Output current drive: These chips have a high output current drive capability, enabling them to drive capacitive loads and long bus lines without signal degradation. 5. ESD protection: They provide built-in electrostatic discharge (ESD) protection, safeguarding the circuit from damage due to static electricity.Application scenarios: 1. Microcontroller interfacing: The N74F245D and 623 chips are commonly used to interface microcontrollers with external devices or peripherals. They enable bidirectional data transfer between the microcontroller and the connected devices. 2. Data communication systems: These chips are suitable for applications involving data communication between different subsystems or modules. They can be used to interface different logic families or voltage levels, ensuring seamless data transfer. 3. Memory interfacing: The chips can be used to interface memory devices, such as RAM or ROM, with a microcontroller or a processor. They facilitate the transfer of data between the memory and the controller. 4. Industrial automation: In industrial automation systems, these chips can be used for communication between various control modules, sensors, and actuators. They ensure reliable and fast data transfer in real-time applications. 5. Automotive electronics: The chips find applications in automotive electronics, where they are used for communication between different electronic control units (ECUs) or modules within a vehicle. They enable data exchange between various systems, such as engine control, transmission control, and body control modules.Overall, the N74F245D and 623 integrated circuit chips offer high-speed, bidirectional data transfer, voltage level translation, and ESD protection, making them suitable for a wide range of applications involving bus transceiver functionality.