74LVC2G125GM,125

74LVC2G125GM,125

Manufacturer No:

74LVC2G125GM,125

Manufacturer:

Nexperia USA Inc.

Description:

IC BUFFER NON-INVERT 5.5V 8XQFN

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC2G125GM,125 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-XQFN (1.6x1.6)
  • Package / Case
    8-XFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVC
The 74LVC2G125GM,125 is a dual bus buffer gate integrated circuit chip. Here are the advantages and application scenarios of this chip:Advantages: 1. Small package and low power consumption: The chip is housed in a small package, making it suitable for space-constrained applications. It also has low power consumption, leading to energy efficiency. 2. Wide supply voltage range: The chip can operate within a wide range of supply voltages (1.65V to 5.5V), providing flexibility in various applications. 3. High-speed operation: It offers fast propagation delay times, allowing for quick signal transmission or buffering. 4. ESD protection: The chip is equipped with ESD protection, making it more robust against electrostatic discharge events, hence improving circuit reliability. 5. Wide temperature range: It can operate across a wide temperature range (-40°C to 125°C), making it suitable for both industrial and consumer applications.Application scenarios: 1. Level shifting: The chip can be used for level shifting between different voltage domains in a circuit, ensuring compatibility between devices with different voltage requirements. 2. Buffering: It can be used to buffer the output signals from one circuit block to another, preventing loading effects and maintaining signal integrity. 3. Voltage translation: The chip can translate signals between different voltage levels, allowing communication between devices operating at different voltage levels, such as interfacing between 3.3V and 5V systems. 4. Clock signal distribution: It can be used to distribute clock signals across multiple devices in a system, ensuring synchronization and preventing signal degradation. 5. I/O expansion: The chip can be used to expand the number of I/O pins available on a microcontroller, facilitating the connection of additional peripherals or sensors. 6. Bus isolation: It can be used for bus isolation, enabling multiple devices to share the same bus without interfering with each other.These advantages and application scenarios make the 74LVC2G125GM,125 chip suitable for various digital logic, communication, and microcontroller-based applications.