74AUP2T1326GF,132
Manufacturer No:
74AUP2T1326GF,132
Manufacturer:
Description:
IC BUFFER NON-INVERT 3.6V 10XSON
Datasheet:
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In Stock : 0
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74AUP2T1326GF,132 Specifications
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TypeParameter
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Supplier Device Package10-XSON (1.7x1)
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Package / Case10-XFDFN
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply1.1V ~ 3.6V
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Current - Output High, Low4mA, 4mA
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Output Type3-State
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Input Type-
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Number of Bits per Element1
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Number of Elements2
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Logic TypeBuffer, Non-Inverting
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series74AUP
The 74AUP2T1326GF,132 is a specific integrated circuit chip, and without detailed information about its specifications and features, it is difficult to provide specific advantages and application scenarios. However, in general, integrated circuit chips offer several advantages:1. Miniaturization: Integrated circuit chips are compact and can contain a large number of electronic components on a single chip, leading to smaller and more portable devices.2. Power Efficiency: Integrated circuits are designed to be power-efficient, allowing devices to operate for longer periods on limited power sources, such as batteries.3. Reliability: Integrated circuits are manufactured using advanced techniques, resulting in high reliability and reduced failure rates.4. Cost-effectiveness: Mass production of integrated circuits reduces manufacturing costs, making them more affordable for various applications.As for application scenarios, integrated circuit chips are used in a wide range of electronic devices, including smartphones, computers, televisions, medical equipment, automotive systems, and many more. They can be found in various industries, such as telecommunications, consumer electronics, healthcare, automotive, and aerospace, to name a few. The specific application of the 74AUP2T1326GF,132 chip would depend on its features and capabilities, which would require further information to provide a more accurate answer.
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