CLVTH162244IDGGREP
Manufacturer No:
CLVTH162244IDGGREP
Manufacturer:
Description:
IC BUF NON-INVERT 3.6V 48TSSOP
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CLVTH162244IDGGREP Specifications
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TypeParameter
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Supplier Device Package48-TSSOP
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Package / Case48-TFSOP (0.240", 6.10mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply2.7V ~ 3.6V
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Current - Output High, Low12mA, 12mA
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Output Type3-State
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Input Type-
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Number of Bits per Element4
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Number of Elements4
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Logic TypeBuffer, Non-Inverting
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series74LVTH
The CLVTH162244IDGGREP integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed operation: These chips are designed to operate at high speeds, making them suitable for applications that require fast data transfer rates. 2. Low power consumption: They are designed to consume minimal power, making them energy-efficient and suitable for battery-powered devices. 3. Wide voltage range: These chips can operate over a wide voltage range, making them compatible with various power supply systems. 4. Bidirectional data flow: They support bidirectional data flow, allowing data to be transmitted in both directions, making them suitable for applications that require data transfer in both directions. 5. ESD protection: They provide Electrostatic Discharge (ESD) protection, ensuring the safety of the chip during handling and operation.Application Scenarios: 1. Communication systems: These chips can be used in communication systems such as routers, switches, and network interface cards to enable high-speed data transfer between different components. 2. Data storage systems: They can be used in storage systems such as solid-state drives (SSDs) and hard disk drives (HDDs) to facilitate data transfer between the storage medium and the host system. 3. Industrial automation: These chips can be used in industrial automation systems to enable fast and reliable data transfer between different components, such as sensors, actuators, and control units. 4. Automotive electronics: They can be used in automotive electronics applications, such as in-vehicle communication systems, to enable high-speed data transfer between different modules and components. 5. Consumer electronics: These chips can be used in various consumer electronics devices, such as smartphones, tablets, and gaming consoles, to facilitate fast data transfer between different components within the device.Overall, the CLVTH162244IDGGREP integrated circuit chips offer high-speed, low power consumption, and bidirectional data flow capabilities, making them suitable for a wide range of applications that require fast and reliable data transfer.
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