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SN74S244DWR

SN74S244DWR

Manufacturer No:

SN74S244DWR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.25V 20SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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SN74S244DWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    4.75V ~ 5.25V
  • Current - Output High, Low
    15mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74S
The MB90022PF-GS-207-BND is a specific model of an integrated circuit chip, and its advantages and application scenarios can vary depending on the specific features and capabilities of the chip. Unfortunately, without more information about the chip's specifications, it is difficult to provide a comprehensive answer.However, in general, integrated circuit chips like the MB90022PF-GS-207-BND offer several advantages and can be used in various application scenarios. Some potential advantages and application scenarios of integrated circuit chips include:1. Miniaturization: Integrated circuit chips are compact and can be manufactured in small sizes, allowing for miniaturization of electronic devices. This makes them suitable for applications where space is limited, such as in mobile phones, wearables, and IoT devices.2. Power efficiency: Integrated circuit chips are designed to be power-efficient, which is crucial for battery-powered devices. They can help extend the battery life of portable devices and reduce power consumption in various applications.3. Cost-effectiveness: Integrated circuit chips are mass-produced, leading to economies of scale and lower production costs. This makes them cost-effective for various applications, including consumer electronics, automotive, industrial automation, and more.4. Performance and functionality: Integrated circuit chips can offer high-performance computing capabilities and a wide range of functionalities. They can be used in applications that require processing power, memory, communication interfaces, and other features.5. Versatility: Integrated circuit chips can be programmed or configured to perform different tasks, making them versatile for various applications. They can be used in different industries, including telecommunications, healthcare, automotive, aerospace, and more.It is important to note that the specific advantages and application scenarios of the MB90022PF-GS-207-BND chip may differ based on its unique features, specifications, and intended use. To get a more accurate understanding of its advantages and application scenarios, it is recommended to refer to the datasheet or technical documentation provided by the manufacturer.
SN74S244DWR Relevant information