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74FCT163244APVG

74FCT163244APVG

Manufacturer No:

74FCT163244APVG

Description:

IC BUF NON-INVERT 3.6V 48SSOP

Datasheet:

Datasheet

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74FCT163244APVG Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-SSOP
  • Package / Case
    48-BSSOP (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    8mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    74FCT
The CY8C3665PVA-007 is a specific model of the PSoC 3 family of integrated circuit chips developed by Cypress Semiconductor. These chips are designed for use in a wide range of applications, offering several advantages and application scenarios. Some of these advantages and scenarios include:1. Programmability: The PSoC 3 chips, including the CY8C3665PVA-007, are highly programmable, allowing users to configure and customize the chip's functionality to meet specific application requirements. This flexibility makes them suitable for a wide range of applications.2. Mixed-signal capabilities: The CY8C3665PVA-007 integrates both analog and digital components, making it suitable for applications that require both types of signals. This mixed-signal capability enables the chip to interface with various sensors, actuators, and other devices.3. Low power consumption: The PSoC 3 chips are designed to be power-efficient, making them suitable for battery-powered or energy-constrained applications. The CY8C3665PVA-007 chip, in particular, offers low power consumption, extending the battery life in portable devices.4. Communication interfaces: The CY8C3665PVA-007 chip supports various communication interfaces, including I2C, SPI, UART, and USB. This makes it suitable for applications that require communication with other devices or systems.5. Embedded system applications: The PSoC 3 chips, including the CY8C3665PVA-007, are commonly used in embedded system applications. These can include industrial automation, consumer electronics, medical devices, automotive systems, and more. The programmability and mixed-signal capabilities of the chip make it versatile for various embedded system designs.6. Sensor integration: The CY8C3665PVA-007 chip includes built-in analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), making it suitable for applications that require sensor integration. This allows for direct interfacing with sensors, such as temperature sensors, pressure sensors, and more.7. System integration: The PSoC 3 chips are designed to integrate multiple components into a single chip, reducing the need for external components and simplifying the overall system design. The CY8C3665PVA-007 chip offers this system integration capability, making it suitable for compact and space-constrained applications.Overall, the CY8C3665PVA-007 chip offers programmability, mixed-signal capabilities, low power consumption, communication interfaces, and system integration, making it suitable for a wide range of embedded system applications.
74FCT163244APVG Relevant information