SN74LVC827ADGVR

SN74LVC827ADGVR

Manufacturer No:

SN74LVC827ADGVR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 24TVSOP

Datasheet:

Datasheet

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SN74LVC827ADGVR Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-TVSOP
  • Package / Case
    24-TFSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The SN74LVC827ADGVR integrated circuit chip is a non-inverting octal buffer and line driver with 3-state outputs. Here are some advantages and application scenarios for this chip:Advantages: 1. High-speed operation: The SN74LVC827ADGVR offers high-speed performance, making it suitable for applications that require quick response and data transmission. 2. 3-state outputs: The chip's 3-state outputs allow for efficient control of signal transmission, enabling multiple devices to be connected to the same bus without interfering with each other. 3. Low power consumption: The chip is designed to operate at low power, making it energy-efficient and suitable for portable and battery-powered devices. 4. Voltage level translation: The SN74LVC827ADGVR can be used to translate voltage levels from one logic family to another, allowing compatibility between devices operating at different voltage levels.Application scenarios: 1. Data transmission and buffering: The SN74LVC827ADGVR can be used in applications where data needs to be transmitted over long distances or between different devices. Its high-speed operation and 3-state outputs enable efficient buffering and signal conditioning. 2. Buses and address decoding: The chip is commonly used in bus systems and address decoding circuits. It can provide multiple outputs with sufficient drive capability to handle the communication between various components in a system. 3. Level shifting and interfacing: The voltage level translation capability of the chip is useful in scenarios where signals from devices operating at different voltage levels need to be interfaced. It ensures proper signal integrity and reliable communication between such devices. 4. ASIC and FPGA interfacing: The SN74LVC827ADGVR is often used to interface application-specific integrated circuits (ASICs) or field-programmable gate arrays (FPGAs) to other components in a system. It acts as a buffer and driver for data and address lines, enabling seamless communication between different parts of an electronic system.It's important to note that the specific advantages and applicability of the SN74LVC827ADGVR chip may vary depending on the requirements and design considerations of a particular application.