CY74FCT827ATQCT
Manufacturer No:
CY74FCT827ATQCT
Manufacturer:
Description:
IC BUF NON-INVERT 5.25V 24SSOP
Datasheet:
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In Stock : 0
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CY74FCT827ATQCT Specifications
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TypeParameter
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Supplier Device Package24-SSOP
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Package / Case24-SSOP (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply4.75V ~ 5.25V
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Current - Output High, Low32mA, 64mA
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Output Type3-State
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Input Type-
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Number of Bits per Element10
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Number of Elements1
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Logic TypeBuffer, Non-Inverting
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series74FCT
The CY74FCT827ATQCT is a specific integrated circuit chip, and without detailed information about its specifications and features, it is challenging to provide specific advantages and application scenarios for this chip. However, in general, integrated circuit chips offer several advantages, such as:1. Compactness: Integrated circuit chips are small in size and can pack a large number of electronic components onto a single chip, saving space in electronic devices.2. Reliability: Integrated circuits are manufactured using advanced techniques, ensuring high reliability and low failure rates.3. Power efficiency: Integrated circuits are designed to operate with low power consumption, making them suitable for battery-powered devices.4. Speed: Integrated circuits can perform calculations and operations at high speeds, enabling fast data processing.As for application scenarios, integrated circuit chips are used in a wide range of electronic devices, including computers, smartphones, televisions, automotive systems, medical equipment, and many more. They can be found in various applications such as data processing, signal amplification, memory storage, and control systems.To provide more specific advantages and application scenarios for the CY74FCT827ATQCT chip, it would be helpful to have more information about its intended purpose and specifications.
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