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74ALVCH162244PAG8

74ALVCH162244PAG8

Manufacturer No:

74ALVCH162244PAG8

Description:

IC BUF NON-INVERT 3.6V 48TSSOP

Datasheet:

Datasheet

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74ALVCH162244PAG8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    12mA, 12mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74ALVCH
The S6J32GEKSNSE20000 integrated circuit chips have several advantages and application scenarios. Some of them include:1. Automotive Applications: These chips are specifically designed for automotive applications, making them suitable for use in various automotive systems such as body control modules, powertrain control modules, and advanced driver-assistance systems (ADAS). They offer high performance and reliability required for automotive environments.2. High Processing Power: The S6J32GEKSNSE20000 chips are equipped with a powerful ARM Cortex-R4F processor, which provides high processing power for handling complex automotive applications and algorithms.3. Safety and Security Features: These chips come with built-in safety and security features, including error correction codes (ECC), memory protection units (MPU), and secure boot functionality. These features ensure the integrity and reliability of the system, making them suitable for safety-critical automotive applications.4. Connectivity Options: The chips support various communication interfaces such as CAN, LIN, Ethernet, and FlexRay, enabling seamless integration with other automotive systems and networks.5. Low Power Consumption: The S6J32GEKSNSE20000 chips are designed to operate with low power consumption, making them suitable for automotive applications where energy efficiency is crucial.6. Scalability: These chips offer scalability options, allowing for easy customization and adaptation to different automotive system requirements.7. Automotive Safety Standards: The chips comply with automotive safety standards such as ISO 26262, ensuring that they meet the stringent safety requirements of the automotive industry.Application scenarios for S6J32GEKSNSE20000 integrated circuit chips include:1. Advanced Driver-Assistance Systems (ADAS): These chips can be used in ADAS applications, such as adaptive cruise control, lane departure warning, and collision avoidance systems, to provide high-performance processing and connectivity capabilities.2. Powertrain Control Modules: The chips can be utilized in powertrain control modules to control and monitor various aspects of the vehicle's engine, transmission, and other powertrain components.3. Body Control Modules: These chips can be employed in body control modules to manage functions like lighting, climate control, and security systems in the vehicle.4. Infotainment Systems: The chips can be integrated into infotainment systems to provide processing power and connectivity for multimedia, navigation, and connectivity features.5. Electric Vehicle Control Units: The chips can be used in electric vehicle control units to manage and control the electric drivetrain, battery management system, and charging infrastructure.Overall, the S6J32GEKSNSE20000 integrated circuit chips offer high performance, reliability, and safety features, making them suitable for a wide range of automotive applications.
74ALVCH162244PAG8 Relevant information