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CD74ACT241M96

CD74ACT241M96

Manufacturer No:

CD74ACT241M96

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 20SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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CD74ACT241M96 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74ACT
The MB89925PF-G-147-BND is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89925PF-G-147-BND chip is designed to deliver high performance, making it suitable for demanding applications. 2. Low Power Consumption: It is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Integrated Features: The chip integrates various features and peripherals, reducing the need for external components and simplifying the overall design. 4. Small Form Factor: The chip is compact in size, making it suitable for applications with space constraints. 5. Cost-Effective: The chip offers a balance between performance and cost, making it an economical choice for various applications.Application Scenarios: 1. Industrial Automation: The MB89925PF-G-147-BND chip can be used in industrial automation systems for controlling and monitoring various processes. 2. Consumer Electronics: It can be used in consumer electronics devices such as smart home appliances, wearable devices, or IoT devices. 3. Automotive: The chip can be utilized in automotive applications for controlling various functions like engine management, infotainment systems, or driver assistance systems. 4. Medical Devices: It can be used in medical devices for data acquisition, signal processing, or control functions. 5. Communication Systems: The chip can be used in communication systems for data processing, networking, or protocol handling.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to refer to the datasheet and technical documentation provided by the manufacturer for detailed information about the chip's capabilities and recommended applications.
CD74ACT241M96 Relevant information