CY74FCT827CTSOCT
Manufacturer No:
CY74FCT827CTSOCT
Manufacturer:
Description:
IC BUF NON-INVERT 5.25V 24SOIC
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In Stock : 0
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CY74FCT827CTSOCT Specifications
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TypeParameter
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Supplier Device Package24-SOIC
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Package / Case24-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply4.75V ~ 5.25V
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Current - Output High, Low32mA, 64mA
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Output Type3-State
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Input Type-
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Number of Bits per Element10
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Number of Elements1
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Logic TypeBuffer, Non-Inverting
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series74FCT
The XL210-256-FB236-C20 integrated circuit chips are part of the Xilinx Virtex UltraScale+ family, specifically designed for advanced applications in sectors such as aerospace, defense, automotive, and telecommunications. These chips offer various advantages and find application in multiple scenarios, including:1. High-performance processing: The XL210-256-FB236-C20 chips provide high-speed processing, allowing for complex computations and data-intensive tasks. They feature multiple processing engines, enabling efficient parallel processing and acceleration.2. Large capacity and scalability: This chip series offers a large number of logic cells, high-speed I/O ports, and extensive on-chip memory. It enables building complex systems with high logic density while allowing room for future expansions.3. Advanced programmability: The XL210-256-FB236-C20 chips are highly programmable, supporting reconfiguration and adaptability. They can be reprogrammed even during runtime, facilitating dynamic changes and upgrades in the system's functionality.4. Security features: Designed for critical applications, these chips include advanced security features such as cryptographic engines, secure boot, and information protection mechanisms. They ensure data confidentiality, integrity, and resistance against tampering or unauthorized access.5. Reduced power consumption: The UltraScale+ family incorporates power-optimized architecture, enabling reduced power consumption while maintaining high performance. This feature makes XL210-256-FB236-C20 chips suitable for power-constrained environments like portable devices or energy-efficient systems.Application scenarios for XL210-256-FB236-C20 chips include:1. Aerospace and defense: These chips are ideal for building advanced radars, communication systems, signal processing modules, and high-performance computing solutions in the aerospace and defense sectors. They can handle demanding tasks like real-time image processing, sensor fusion, and autonomous systems.2. Automotive: XL210-256-FB236-C20 chips can be used in advanced driver-assistance systems (ADAS), self-driving cars, and vehicle-to-everything (V2X) communication modules. They offer the necessary computational power for real-time analysis of sensor data, object detection, and decision-making.3. Telecommunications: These chips find application in network equipment, routers, and switches, enabling high-speed data processing and traffic management. They support protocols like Ethernet, fiber channel, and wireless communication standards, providing optimized networking solutions.4. High-performance computing: XL210-256-FB236-C20 chips can be used in scientific research, weather forecasting, and simulations, where massive parallel processing and high-speed data transfer are crucial. They can accelerate computation-intensive tasks, enhancing overall system performance.5. Industrial automation: In industrial control systems, robotics, and machine vision applications, these chips enable real-time machine control, image processing, and data analysis. They ensure high accuracy, low latency, and quick response times.Overall, XL210-256-FB236-C20 integrated circuit chips offer tremendous advantages like high performance, scalability, advanced programmability, security, and low power consumption. These qualities make them suitable for a wide range of applications in demanding industries.
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