SN74F241NSR

SN74F241NSR

Manufacturer No:

SN74F241NSR

Manufacturer:

Texas Instruments

Description:

IC BUFFER NON-INVERT 5.5V 20SO

Datasheet:

Datasheet

Delivery:

Payment:

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SN74F241NSR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SO
  • Package / Case
    20-SOIC (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    15mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74F
The CY8C3246AXA-140 is a specific model of the PSoC 3 family of integrated circuit chips developed by Cypress Semiconductor. These chips are designed for embedded systems and offer a range of advantages and application scenarios. Some of these advantages and scenarios include:1. Programmability: The PSoC 3 chips are highly programmable, allowing developers to configure and customize the functionality of the chip to meet specific application requirements. This flexibility makes them suitable for a wide range of applications.2. Integration: The CY8C3246AXA-140 chip integrates multiple components and peripherals, including a microcontroller, digital and analog blocks, and communication interfaces. This integration reduces the need for external components, simplifying the design and reducing the overall system cost.3. Low power consumption: The PSoC 3 chips are designed to operate at low power, making them suitable for battery-powered applications or energy-efficient systems.4. Analog and digital capabilities: The CY8C3246AXA-140 chip combines both analog and digital functionality, allowing it to interface with a variety of sensors, actuators, and other devices. This makes it suitable for applications such as industrial control, home automation, and Internet of Things (IoT) devices.5. Communication interfaces: The chip supports various communication interfaces, including UART, SPI, I2C, and USB. This enables seamless connectivity with other devices and systems, making it suitable for applications that require data exchange or communication.6. Real-time processing: The PSoC 3 chips offer real-time processing capabilities, making them suitable for applications that require fast and responsive control, such as motor control, robotics, and automation.7. Development ecosystem: Cypress Semiconductor provides a comprehensive development ecosystem, including software development tools, libraries, and documentation, to support the design and development process using PSoC 3 chips. This ecosystem simplifies the development process and accelerates time-to-market.Application scenarios for the CY8C3246AXA-140 chip include:1. Industrial control systems: The chip's analog and digital capabilities, along with its communication interfaces, make it suitable for applications such as process control, monitoring, and automation in industrial environments.2. Home automation: The chip can be used in home automation systems to control and monitor various devices, such as lighting, HVAC systems, security systems, and smart appliances.3. Internet of Things (IoT) devices: The CY8C3246AXA-140 chip's low power consumption, communication interfaces, and programmability make it suitable for IoT devices, such as smart sensors, wearable devices, and connected appliances.4. Medical devices: The chip's real-time processing capabilities and analog functionality make it suitable for medical devices, such as patient monitoring systems, diagnostic equipment, and drug delivery systems.5. Consumer electronics: The chip can be used in various consumer electronics applications, such as gaming consoles, remote controls, audio systems, and smart home devices.Overall, the CY8C3246AXA-140 chip offers a versatile and flexible solution for a wide range of embedded system applications, combining programmability, integration, low power consumption, and communication capabilities.