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SN74AUP3G07YFPR

SN74AUP3G07YFPR

Manufacturer No:

SN74AUP3G07YFPR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 8DSBGA

Datasheet:

Datasheet

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SN74AUP3G07YFPR Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-DSBGA
  • Package / Case
    8-XFBGA, DSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    -, 4mA
  • Output Type
    Open Drain
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    3
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AUP
The SN74AUP3G07YFPR is a specific model of integrated circuit chip manufactured by Texas Instruments. It is a triple buffer/driver with open-drain outputs, designed for low-voltage and low-power applications. Here are some advantages and application scenarios of this chip:Advantages: 1. Low-voltage operation: The SN74AUP3G07YFPR operates at a voltage range of 0.8V to 3.6V, making it suitable for low-power and battery-operated devices. 2. Low power consumption: It has a low power dissipation, making it energy-efficient and suitable for power-sensitive applications. 3. High-speed operation: The chip has a high-speed propagation delay, enabling fast data transmission and processing. 4. Open-drain outputs: The open-drain outputs allow for flexible interfacing with other devices and can be used for wired-OR or wired-AND configurations. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications.Application scenarios: 1. Mobile devices: The low-voltage and low-power characteristics of the SN74AUP3G07YFPR make it suitable for use in smartphones, tablets, and other portable devices. 2. IoT devices: With its low power consumption and small form factor, the chip can be used in various Internet of Things (IoT) devices such as sensors, wearables, and smart home devices. 3. Communication systems: The high-speed operation of the chip makes it suitable for use in communication systems, including data transmission, signal buffering, and level shifting. 4. Industrial automation: The chip can be used in industrial automation systems for interfacing and buffering signals between different components and devices. 5. Automotive electronics: The low-voltage operation and small form factor make the chip suitable for automotive applications, such as in-car entertainment systems, control modules, and sensor interfaces.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or system in which the chip is being used.
SN74AUP3G07YFPR Relevant information