SN74AUP2G17YFPR
Manufacturer No:
SN74AUP2G17YFPR
Manufacturer:
Description:
IC BUF NON-INVERT 3.6V 6DSBGA
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SN74AUP2G17YFPR Specifications
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TypeParameter
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Supplier Device Package6-DSBGA
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Package / Case6-XFBGA, DSBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply0.8V ~ 3.6V
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Current - Output High, Low4mA, 4mA
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Output TypePush-Pull
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Input TypeSchmitt Trigger
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Number of Bits per Element1
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Number of Elements2
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Logic TypeBuffer, Non-Inverting
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series74AUP
The R5F21246SDFP#V2 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: The chips are based on the Renesas RXv2 core, which offers high processing power and performance. 2. Low power consumption: The chips are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 3. Rich peripheral set: The chips come with a wide range of built-in peripherals such as UART, SPI, I2C, ADC, timers, and more, providing flexibility and ease of integration. 4. Enhanced security features: The chips offer advanced security features like a hardware encryption engine, memory protection unit, and tamper detection, ensuring data integrity and system security. 5. Ample memory: The chips have a large flash memory and RAM capacity, allowing for the storage and execution of complex applications.Application scenarios: 1. Internet of Things (IoT) devices: The chips are suitable for IoT applications due to their low power consumption, high processing power, and built-in communication interfaces like UART and SPI. 2. Industrial automation: The chips can be used in industrial automation systems for controlling and monitoring various processes, thanks to their high performance, rich peripheral set, and security features. 3. Consumer electronics: The chips can be utilized in various consumer electronic devices like smart home appliances, wearables, and audio/video equipment, benefiting from their low power consumption, high processing power, and memory capacity. 4. Automotive applications: The chips can be employed in automotive systems such as engine control units (ECUs), body control modules (BCMs), and infotainment systems, leveraging their high performance, security features, and robustness. 5. Medical devices: The chips can be used in medical devices like patient monitoring systems, diagnostic equipment, and portable medical devices, taking advantage of their low power consumption, high processing power, and security features.These are just a few examples, and the R5F21246SDFP#V2 chips can be applied in various other domains where a combination of high performance, low power consumption, security, and rich peripheral set is required.
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