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74AUP3G17GNX

74AUP3G17GNX

Manufacturer No:

74AUP3G17GNX

Manufacturer:

Nexperia USA Inc.

Description:

IC BUFFER NON-INVERT 3.6V 8XSON

Datasheet:

Datasheet

Delivery:

Payment:

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74AUP3G17GNX Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-XSON, SOT833-1 (1.95x1)
  • Package / Case
    8-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    4mA, 4mA
  • Output Type
    Push-Pull
  • Input Type
    Schmitt Trigger
  • Number of Bits per Element
    1
  • Number of Elements
    3
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AUP
The MB90224PF-GT-277-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a 32-bit RISC CPU core, operating at a clock frequency of up to 80 MHz. 2. Low Power Consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich Peripherals: They come with a wide range of built-in peripherals, including UART, I2C, SPI, timers, A/D converters, and more, providing flexibility for various applications. 4. Ample Memory: The chips have a large on-chip memory, including flash memory for program storage and RAM for data storage, enabling the execution of complex applications. 5. Robust Connectivity: They support various communication interfaces like Ethernet, USB, CAN, and LIN, allowing seamless connectivity with other devices or networks.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and connectivity options. 2. Internet of Things (IoT): With their low power consumption and connectivity features, these chips are suitable for IoT applications, such as smart home devices, wearables, or environmental monitoring systems. 3. Automotive Electronics: The chips' robust connectivity options, along with their ability to withstand harsh environments, make them suitable for automotive applications like engine control units, dashboard systems, or infotainment systems. 4. Consumer Electronics: These chips can be used in various consumer electronic devices, including home appliances, gaming consoles, or multimedia devices, due to their high performance and rich peripheral set. 5. Medical Devices: The chips' low power consumption, ample memory, and connectivity options make them suitable for medical devices like patient monitoring systems, portable medical devices, or diagnostic equipment.Overall, the MB90224PF-GT-277-BND integrated circuit chips offer high performance, low power consumption, rich peripherals, and robust connectivity, making them versatile for a wide range of applications in different industries.
74AUP3G17GNX Relevant information