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74HCT241PW,112

74HCT241PW,112

Manufacturer No:

74HCT241PW,112

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 5.5V 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74HCT241PW,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    6mA, 6mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74HCT
The DSPIC33EP128GS804-I/ML integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33E core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature multiple communication interfaces such as UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices. 4. Rich Peripherals: The chips offer a wide range of peripherals like timers, PWM modules, ADCs, and DACs, providing flexibility in designing various applications. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robust Security: The chips come with security features like code protection and tamper detection, ensuring the integrity and confidentiality of the embedded software.Application Scenarios: 1. Motor Control: The chips' high-performance DSP capabilities and PWM modules make them ideal for motor control applications, such as industrial automation, robotics, and electric vehicles. 2. Power Electronics: They can be used in power electronics applications like inverters, power supplies, and renewable energy systems, where real-time control and high efficiency are crucial. 3. Communication Systems: The chips' communication interfaces make them suitable for applications like wireless communication, IoT devices, and networking equipment. 4. Audio and Speech Processing: With their DSP capabilities, the chips can be used in audio and speech processing applications, such as audio amplifiers, voice recognition systems, and audio codecs. 5. Medical Devices: The chips' high performance, low power consumption, and security features make them suitable for medical devices like patient monitoring systems, diagnostic equipment, and implantable devices. 6. Automotive Electronics: They can be used in automotive applications like engine control units, dashboard systems, and advanced driver-assistance systems (ADAS), where real-time processing and connectivity are essential.Overall, the DSPIC33EP128GS804-I/ML integrated circuit chips offer a combination of high performance, DSP capabilities, connectivity, and security, making them suitable for a wide range of applications in various industries.
74HCT241PW,112 Relevant information