TC74VCX244FTEL

TC74VCX244FTEL

Manufacturer No:

TC74VCX244FTEL

Description:

IC BUF NON-INVERT 3.6V 20TSSOP

Datasheet:

Datasheet

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TC74VCX244FTEL Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.2V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Not For New Designs
  • Series
    TC74VCX
The LPC2364FBD100K is a specific model of integrated circuit chip manufactured by NXP Semiconductors. It belongs to the LPC2000 series of microcontrollers and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High-performance: The LPC2364FBD100K chip is based on the ARM7TDMI-S core, which provides a high level of processing power and performance. 2. Low power consumption: It is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Integrated peripherals: The chip includes various integrated peripherals such as UART, SPI, I2C, ADC, PWM, and timers, which simplify the design process and reduce the need for external components. 4. Ample memory: It has a large on-chip memory, including flash memory for program storage and RAM for data storage, allowing for complex applications and data manipulation. 5. Extensive connectivity options: The chip supports various communication interfaces like USB, Ethernet, CAN, and more, enabling connectivity with other devices or networks.Application scenarios: 1. Embedded systems: The LPC2364FBD100K chip is commonly used in embedded systems, where it can control and monitor various functions in devices like industrial automation systems, consumer electronics, medical devices, and more. 2. Internet of Things (IoT): With its connectivity options, the chip can be utilized in IoT applications, enabling devices to connect to the internet and communicate with other devices or cloud services. 3. Robotics: The high-performance capabilities of the chip make it suitable for controlling robotic systems, providing the necessary processing power and connectivity for complex robotic applications. 4. Automotive: The chip can be used in automotive applications, such as engine control units (ECUs), dashboard systems, or other vehicle control systems. 5. Industrial control: The integrated peripherals and communication interfaces make the chip suitable for various industrial control applications, including process control, monitoring systems, and automation.These are just a few examples of the advantages and application scenarios of the LPC2364FBD100K integrated circuit chip. The specific usage will depend on the requirements and needs of the project or application.