74AUP1G17FX4-7

74AUP1G17FX4-7

Manufacturer No:

74AUP1G17FX4-7

Manufacturer:

Diodes Incorporated

Description:

IC BUFFER NON-INVERT 3.6V 6DFN

Datasheet:

Datasheet

Delivery:

Payment:

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74AUP1G17FX4-7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    X2-DFN1409-6
  • Package / Case
    6-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    4mA, 4mA
  • Output Type
    Push-Pull
  • Input Type
    Schmitt Trigger
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AUP
The MB90022PF-GS-159-BND integrated circuit chip is a specific model of a microcontroller chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB90022PF-GS-159-BND chip offers high processing power and performance, making it suitable for demanding applications. 2. Low Power Consumption: It is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Integrated Peripherals: The chip includes various integrated peripherals such as timers, UART, I2C, SPI, and GPIO, reducing the need for external components and simplifying the design process. 4. Ample Memory: It provides sufficient on-chip memory, including RAM and Flash memory, for storing program code and data. 5. Robust Connectivity: The chip supports various communication interfaces like UART, I2C, and SPI, enabling seamless connectivity with other devices or systems.Application Scenarios: 1. Industrial Automation: The MB90022PF-GS-159-BND chip can be used in industrial automation systems for controlling and monitoring processes, machinery, or equipment. 2. Consumer Electronics: It can be employed in various consumer electronic devices such as smart home appliances, wearable devices, or IoT devices. 3. Automotive Systems: The chip can be utilized in automotive applications like engine control units (ECUs), dashboard systems, or vehicle diagnostics. 4. Medical Devices: It can be integrated into medical devices such as patient monitoring systems, diagnostic equipment, or portable medical devices. 5. Internet of Things (IoT): The chip can be used in IoT applications for sensor data processing, connectivity, and control in smart cities, agriculture, or environmental monitoring.It is important to note that the specific advantages and application scenarios may vary based on the requirements, and it is recommended to refer to the manufacturer's documentation and specifications for detailed information.