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74LVC1G126FS3-7

74LVC1G126FS3-7

Manufacturer No:

74LVC1G126FS3-7

Manufacturer:

Diodes Incorporated

Description:

IC BUF NON-INVERT 5.5V 4X2DFN

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC1G126FS3-7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    X2-DFN0808-4
  • Package / Case
    4-XFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The 74LVC1G126FS3-7 is a single buffer/driver with tri-state output integrated circuit chip. Some of the advantages and application scenarios of this chip are as follows:Advantages: 1. Small package: The chip comes in an ultra-small DFN1210-6 (SOT886) package, making it suitable for applications where space is limited. 2. Low power consumption: The chip operates at low power supply voltage, making it energy-efficient and suitable for battery-powered devices. 3. High-speed operation: The chip supports high-speed data transmission, making it suitable for applications where quick signal propagation is required. 4. Tri-state output: The chip has a tri-state output, allowing multiple devices to share the same data bus without conflicts. 5. ESD protection: The chip provides Electrostatic Discharge (ESD) protection, helping to safeguard against electrostatic damage during handling and operation.Application scenarios: 1. Bus buffering: The chip can be used to buffer and amplify signals transmitted over a bus, allowing for reliable communication between different parts of a system. 2. Level shifting: The chip can be used to interface between devices operating at different voltage levels, ensuring compatibility and smooth signal transfer. 3. Signal isolation: The chip can be utilized to isolate and protect sensitive circuitry from potentially harmful signals or noise on a shared bus. 4. I/O expansion: The chip can be used to expand the input/output capabilities of microcontrollers or other devices by providing additional buffering and signal driving. 5. Sensor interfacing: The chip can be employed as an interface between sensors and microcontrollers, ensuring proper signal conditioning and level conversion.These are just a few examples of the advantages and application scenarios of the 74LVC1G126FS3-7 chip, and its utility can vary depending on the specific requirements of a given project.
74LVC1G126FS3-7 Relevant information