CD74HCT240E

CD74HCT240E

Manufacturer No:

CD74HCT240E

Manufacturer:

Texas Instruments

Description:

IC BUFFER INVERT 5.5V 20DIP

Datasheet:

Datasheet

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CD74HCT240E Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-PDIP
  • Package / Case
    20-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    6mA, 6mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Inverting
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    74HCT
The DSPIC33FJ128MC802-E/MM integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: These chips are based on the dsPIC33F core, which offers high computational performance and efficient instruction execution. 2. Digital Signal Processing (DSP) capabilities: The chips have a wide range of DSP features, including multiply-accumulate (MAC) units, hardware support for division, and a variety of digital filters. 3. Enhanced connectivity: They provide multiple communication interfaces such as UART, SPI, I2C, and CAN, enabling seamless integration with other devices and systems. 4. Rich peripheral set: The chips offer a wide range of peripherals, including timers, PWM modules, analog-to-digital converters (ADCs), and digital-to-analog converters (DACs), allowing for versatile application development. 5. Low power consumption: They are designed to operate at low power, making them suitable for battery-powered applications.Application scenarios: 1. Motor control: The DSPIC33FJ128MC802-E/MM chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and rich peripheral set make them ideal for precise and efficient motor control algorithms. 2. Power electronics: These chips can be used in power electronics applications, including inverters, power supplies, and energy management systems. Their high computational performance and connectivity options enable efficient control and monitoring of power conversion processes. 3. Audio processing: The DSP capabilities of these chips make them suitable for audio processing applications, such as audio effects, audio synthesis, and audio compression. They can handle complex algorithms and provide high-quality audio output. 4. Communication systems: The integrated communication interfaces of these chips make them suitable for various communication systems, including wireless communication, IoT devices, and networking equipment. They can handle data transmission and protocol handling efficiently. 5. Medical devices: The low power consumption and high-performance features of these chips make them suitable for medical devices, such as patient monitoring systems, medical imaging equipment, and implantable devices. They can process and analyze medical data accurately and efficiently.Overall, the DSPIC33FJ128MC802-E/MM integrated circuit chips offer high-performance DSP capabilities, enhanced connectivity, and a rich peripheral set, making them suitable for a wide range of applications requiring efficient signal processing and control.