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NLV74HCT125ADR2G

NLV74HCT125ADR2G

Manufacturer No:

NLV74HCT125ADR2G

Manufacturer:

onsemi

Description:

IC BUFFER NON-INVERT 6V 14SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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NLV74HCT125ADR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    6mA, 6mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74HCT
The MB90022PF-GS-205-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a maximum operating frequency of 20 MHz, making them suitable for demanding applications. 2. Low Power Consumption: The chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Small Form Factor: The chips come in a compact package, allowing for easy integration into space-constrained designs. 4. Versatile I/O Interfaces: The chips support various I/O interfaces, including UART, I2C, and SPI, enabling seamless communication with other devices or peripherals. 5. Rich Peripherals: They offer a range of built-in peripherals such as timers, PWM outputs, and ADCs, providing flexibility for different application requirements. 6. Robust Security Features: The chips incorporate security features like a hardware random number generator and memory protection unit, ensuring data integrity and protection against unauthorized access.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for tasks like data acquisition, control, and communication, thanks to their high performance and versatile I/O interfaces. 2. Internet of Things (IoT): With their low power consumption and small form factor, these chips are suitable for IoT applications such as smart home devices, wearables, and sensor nodes. 3. Consumer Electronics: The chips can be utilized in various consumer electronics products like gaming consoles, remote controls, and home appliances, where their high performance and low power consumption are advantageous. 4. Medical Devices: These chips can be employed in medical devices such as patient monitoring systems, portable diagnostic tools, and medical implants, benefiting from their small size, low power consumption, and security features. 5. Automotive Electronics: The chips can find applications in automotive electronics for tasks like engine control, dashboard displays, and communication modules, leveraging their robustness, performance, and security features.Overall, the MB90022PF-GS-205-BND integrated circuit chips offer a combination of high performance, low power consumption, small form factor, and security features, making them suitable for a wide range of applications in various industries.
NLV74HCT125ADR2G Relevant information