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74LVT162244BDGG:51

74LVT162244BDGG:51

Manufacturer No:

74LVT162244BDGG:51

Manufacturer:

NXP USA Inc.

Description:

IC BUF NON-INVERT 3.6V 48TSSOP

Datasheet:

Datasheet

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74LVT162244BDGG:51 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    12mA, 12mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVT
The LM3S611-IQN50-C2 is an integrated circuit chip from Texas Instruments. It belongs to the Stellaris LM3S6000 series of microcontrollers. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The LM3S611-IQN50-C2 is based on the ARM Cortex-M3 core, which offers excellent performance and efficiency for embedded applications. 2. Integrated Peripherals: It includes various integrated peripherals such as UART, I2C, SPI, GPIO, and timers, which simplify the design process and reduce the need for external components. 3. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered applications or energy-efficient designs. 4. Ample Memory: It has a Flash memory of 50KB and a RAM of 16KB, providing sufficient space for program storage and data handling. 5. Rich Development Ecosystem: Texas Instruments provides a comprehensive development ecosystem, including software libraries, development tools, and documentation, making it easier for developers to work with the chip.Application Scenarios: 1. Industrial Automation: The LM3S611-IQN50-C2 can be used in industrial automation systems for controlling and monitoring various processes. Its high performance and integrated peripherals make it suitable for applications like motor control, sensor interfacing, and communication protocols. 2. Internet of Things (IoT): With its low power consumption and integrated connectivity options, the chip can be used in IoT devices such as smart home systems, wearable devices, and environmental monitoring systems. 3. Consumer Electronics: The chip can be utilized in various consumer electronics applications like home appliances, gaming consoles, and audio/video equipment, where its performance, low power, and integrated peripherals can enhance functionality and efficiency. 4. Medical Devices: The LM3S611-IQN50-C2 can be employed in medical devices such as patient monitoring systems, portable medical instruments, and diagnostic equipment, where its high performance, low power, and integrated peripherals are crucial. 5. Automotive: The chip can be used in automotive applications like vehicle control systems, infotainment systems, and advanced driver-assistance systems (ADAS), where its performance, connectivity, and low power consumption are advantageous.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of the project.
74LVT162244BDGG:51 Relevant information