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74HCT365PW,118

74HCT365PW,118

Manufacturer No:

74HCT365PW,118

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 5.5V 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74HCT365PW,118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    6mA, 6mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    6
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74HCT
The R5F100GLAFB#30 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: The R5F100GLAFB#30 chips are built on the Renesas RXv1 core, which offers high processing power and performance. 2. Low power consumption: These chips are designed to operate efficiently with low power consumption, making them suitable for battery-powered devices. 3. Rich peripheral set: The chips come with a wide range of built-in peripherals such as UART, I2C, SPI, ADC, timers, and more, providing flexibility for various applications. 4. Enhanced security features: The R5F100GLAFB#30 chips offer advanced security features like a memory protection unit (MPU) and a hardware encryption module, ensuring data integrity and protection against unauthorized access. 5. Extensive development tools and support: Renesas provides a comprehensive set of development tools, software libraries, and technical support to facilitate the design and development process.Application scenarios: 1. Internet of Things (IoT) devices: The low power consumption and rich peripheral set make these chips suitable for IoT applications such as smart home devices, wearables, and industrial sensors. 2. Consumer electronics: The high-performance capabilities of the R5F100GLAFB#30 chips make them suitable for applications like gaming consoles, audio/video equipment, and home appliances. 3. Industrial automation: These chips can be used in industrial automation systems for controlling and monitoring processes, motor control, and communication interfaces. 4. Automotive electronics: The R5F100GLAFB#30 chips are automotive-grade and can be used in automotive applications like engine control units (ECUs), body control modules (BCMs), and infotainment systems. 5. Medical devices: The low power consumption and security features of these chips make them suitable for medical devices such as patient monitoring systems, portable medical equipment, and implantable devices.Overall, the R5F100GLAFB#30 integrated circuit chips offer high performance, low power consumption, and a rich set of peripherals, making them suitable for a wide range of applications in various industries.
74HCT365PW,118 Relevant information