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74VHC244BQ,115

74VHC244BQ,115

Manufacturer No:

74VHC244BQ,115

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 5.5V 20DHVQFN

Datasheet:

Datasheet

Delivery:

Payment:

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74VHC244BQ,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-DHVQFN (4.5x2.5)
  • Package / Case
    20-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    2V ~ 5.5V
  • Current - Output High, Low
    8mA, 8mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74VHC
The LPC1313FBD48/01,15 is a specific model of the LPC13xx series microcontroller chips manufactured by NXP Semiconductors. These chips offer several advantages and can be applied in various scenarios. Here are some of the advantages and application scenarios of the LPC1313FBD48/01,15 integrated circuit chips:Advantages: 1. High-performance: The LPC1313FBD48/01,15 chips are based on the ARM Cortex-M3 core, which provides excellent processing power and performance for embedded applications. 2. Low power consumption: These chips are designed to operate at low power, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich peripheral set: The LPC1313FBD48/01,15 chips come with a wide range of integrated peripherals, including UART, SPI, I2C, GPIO, ADC, and timers. This allows for easy interfacing with various external devices and sensors. 4. Ample memory: These chips typically have a sufficient amount of flash memory and RAM, enabling the storage and execution of complex applications. 5. Easy development: NXP provides a comprehensive software development kit (SDK) and integrated development environment (IDE) for programming and debugging these chips, making the development process more accessible and efficient.Application Scenarios: 1. Internet of Things (IoT) devices: The LPC1313FBD48/01,15 chips can be used in IoT devices due to their low power consumption, small form factor, and ability to connect to various communication interfaces like Wi-Fi, Bluetooth, or Ethernet. 2. Industrial automation: These chips are suitable for industrial automation applications, such as motor control, sensor interfacing, and data acquisition, due to their high performance, rich peripheral set, and real-time capabilities. 3. Consumer electronics: The LPC1313FBD48/01,15 chips can be utilized in various consumer electronic devices like smart home appliances, wearable devices, or gaming peripherals, thanks to their low power consumption, processing power, and ease of development. 4. Automotive applications: These chips can be employed in automotive applications, such as engine control units (ECUs), dashboard displays, or advanced driver-assistance systems (ADAS), due to their robustness, real-time capabilities, and ability to withstand harsh environments. 5. Medical devices: The LPC1313FBD48/01,15 chips can be used in medical devices like patient monitoring systems, portable medical instruments, or drug delivery systems, benefiting from their low power consumption, processing power, and ability to interface with various sensors.It's important to note that the specific application scenarios may vary depending on the requirements and specifications of the project.
74VHC244BQ,115 Relevant information