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74AUP2G126GS,115

74AUP2G126GS,115

Manufacturer No:

74AUP2G126GS,115

Manufacturer:

Nexperia USA Inc.

Description:

IC BUFFER NON-INVERT 3.6V 8XSON

Datasheet:

Datasheet

Delivery:

Payment:

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74AUP2G126GS,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-XSON (1.35x1)
  • Package / Case
    8-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    4mA, 4mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AUP
The MB89663PF-GT-124-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the 16-bit CISC architecture and offer high processing power, making them suitable for demanding applications. 2. Low Power Consumption: The chips are designed to operate efficiently with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Integrated Peripherals: The chips come with various integrated peripherals such as UART, I2C, SPI, timers, and PWM, reducing the need for external components and simplifying the overall system design. 4. Enhanced Security: The chips offer security features like a hardware random number generator and a memory protection unit, ensuring data integrity and system security. 5. Wide Operating Temperature Range: These chips can operate reliably in a wide temperature range, making them suitable for industrial applications.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring various processes, thanks to their high performance and reliability. 2. Automotive Electronics: With their low power consumption and wide temperature range, these chips can be used in automotive electronics for applications like engine control units, dashboard systems, or advanced driver-assistance systems (ADAS). 3. Consumer Electronics: The chips can be used in consumer electronics devices like smart home systems, wearable devices, or gaming consoles, where a balance of performance and power efficiency is required. 4. Medical Devices: These chips can be utilized in medical devices such as patient monitoring systems, medical imaging equipment, or portable medical devices, where reliability and low power consumption are critical. 5. Internet of Things (IoT): The chips can be used in IoT devices for various applications like smart meters, environmental monitoring systems, or asset tracking devices, where low power consumption and integrated peripherals are essential.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or system.
74AUP2G126GS,115 Relevant information