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74LVC2G125GS,115

74LVC2G125GS,115

Manufacturer No:

74LVC2G125GS,115

Manufacturer:

Nexperia USA Inc.

Description:

IC BUFFER NON-INVERT 5.5V 8XSON

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC2G125GS,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-XSON (1.35x1)
  • Package / Case
    8-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The MB89663RPF-G-179-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the 16-bit CISC architecture and offer high processing power and performance. 2. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 3. Integrated Peripherals: The chips come with various integrated peripherals such as UART, I2C, SPI, timers, and PWM, reducing the need for external components and simplifying the overall system design. 4. Rich Memory Options: They offer a range of memory options, including Flash memory, SRAM, and EEPROM, providing flexibility for different application requirements. 5. Enhanced Security Features: These chips come with built-in security features like memory protection units and encryption/decryption capabilities, ensuring data integrity and system security.Application Scenarios: 1. Industrial Automation: The MB89663RPF-G-179-BND chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and integrated peripherals. 2. Consumer Electronics: They are suitable for various consumer electronic devices like smart home appliances, wearable devices, and gaming consoles, where low power consumption and high processing power are essential. 3. Automotive Electronics: These chips can be used in automotive applications such as engine control units, dashboard systems, and infotainment systems, leveraging their robust performance, integrated peripherals, and security features. 4. Internet of Things (IoT): The low power consumption and integrated peripherals make these chips ideal for IoT devices, enabling connectivity, data processing, and control in smart homes, industrial IoT, and healthcare applications. 5. Embedded Systems: The MB89663RPF-G-179-BND chips can be used in various embedded systems, including robotics, medical devices, and communication equipment, where a balance of performance, power efficiency, and security is required.Overall, the MB89663RPF-G-179-BND integrated circuit chips offer a combination of high performance, low power consumption, integrated peripherals, and security features, making them suitable for a wide range of applications in different industries.
74LVC2G125GS,115 Relevant information