Home / Buffers, Drivers, Receivers, Transceivers / 74AVC16T245DGV,118/
74AVC16T245DGV,118

74AVC16T245DGV,118

Manufacturer No:

74AVC16T245DGV,118

Manufacturer:

Nexperia USA Inc.

Description:

IC TRANSLATOR BIDIR 48TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

74AVC16T245DGV,118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    12mA, 12mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    2
  • Logic Type
    Translation Transceiver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AVC
The 74AVC16T245DGV,118 integrated circuit chip, also known as a voltage level translator, has several advantages and application scenarios.Advantages: 1. Bi-directional level translation: The chip can translate and provide level conversion between different voltage domains, allowing for seamless communication between different systems operating at different voltage levels. 2. Wide input/output voltage range: The chip supports a wide voltage range, typically from 0.9V to 3.6V, making it suitable for a variety of applications. 3. High-speed operation: It operates at high-speed, enabling fast data transmission between different voltage domains. 4. Minimal power consumption: The chip is designed to consume low power, making it suitable for battery-powered devices and power-sensitive applications. 5. ESD protection: It provides Electrostatic Discharge (ESD) protection, safeguarding the connected systems from potentially damaging voltage spikes.Application Scenarios: 1. Mixed voltage systems: The chip is commonly used in systems where different components or subsystems operate at different voltage levels. It ensures smooth communication and data transfer between these systems. 2. I/O expansion: It can be used to interface microcontrollers, digital signal processors, or other digital devices with different voltage requirements, allowing for increased I/O (Input/Output) capability. 3. Interfacing with different interface standards: It facilitates interfacing between circuits or modules using different interface standards like UART, SPI, I2C, etc., which may operate at different voltage levels. 4. Fieldbus communication: It can be utilized in fieldbus systems, such as industrial automation, where different devices and sensors communicate with each other using different voltage levels. 5. Mobile devices: The chip can be used in smartphones, tablets, or any portable electronic devices to support communication and data transfer between different modules operating at different voltage levels, such as audio codec, camera module, memory chips, etc.Overall, the 74AVC16T245DGV,118 integrated circuit chip offers level translation capabilities, wide voltage range, high-speed operation, low power consumption, and ESD protection, making it suitable for various applications involving different voltage domains.
74AVC16T245DGV,118 Relevant information