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SN74LVC1G17DCKR

SN74LVC1G17DCKR

Manufacturer No:

SN74LVC1G17DCKR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V SC70-5

Datasheet:

Datasheet

Delivery:

Payment:

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SN74LVC1G17DCKR Specifications

  • Type
    Parameter
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    Push-Pull
  • Input Type
    Schmitt Trigger
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The DSPIC33EP128GP502-I/MM integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The DSPIC33EP128GP502-I/MM chips are designed to deliver high performance with a 70 MIPS (Million Instructions Per Second) performance and a 16-bit microcontroller core. This makes them suitable for applications that require fast and efficient processing.2. Digital Signal Processing (DSP) Capabilities: These chips are specifically designed for digital signal processing applications. They offer a wide range of DSP instructions and peripherals, making them ideal for applications such as audio processing, motor control, and power conversion.3. Integrated Peripherals: The chips come with a variety of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration reduces the need for external components, simplifying the design and reducing the overall cost.4. Low Power Consumption: The DSPIC33EP128GP502-I/MM chips are designed to operate at low power, making them suitable for battery-powered applications or devices that require energy efficiency.Application Scenarios: 1. Motor Control: The DSPIC33EP128GP502-I/MM chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and integrated peripherals make them suitable for precise and efficient motor control.2. Audio Processing: These chips can be used in audio processing applications, such as audio effects processors, audio mixers, and digital audio amplifiers. The DSP capabilities and integrated ADCs/DACs enable high-quality audio processing and playback.3. Power Conversion: The chips can be applied in power conversion applications, such as inverters, power supplies, and battery chargers. The integrated peripherals, including ADCs and PWM modules, enable accurate and efficient power conversion.4. Industrial Control Systems: The DSPIC33EP128GP502-I/MM chips are suitable for various industrial control systems, including PLCs (Programmable Logic Controllers), process control systems, and monitoring systems. Their high-performance processing capabilities and integrated peripherals make them ideal for real-time control and monitoring.5. Communication Systems: These chips can be used in communication systems, such as wireless sensor networks, IoT (Internet of Things) devices, and data loggers. The integrated peripherals, including UARTs, SPI, and I2C, enable seamless communication with other devices and networks.Overall, the DSPIC33EP128GP502-I/MM integrated circuit chips offer high performance, DSP capabilities, integrated peripherals, and low power consumption, making them suitable for a wide range of applications in various industries.
SN74LVC1G17DCKR Relevant information