5962-9221303M2A

5962-9221303M2A

Manufacturer No:

5962-9221303M2A

Manufacturer:

Texas Instruments

Description:

IC BUFFER INVERT 5.5V 20LCC

Datasheet:

Datasheet

Delivery:

Payment:

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5962-9221303M2A Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-LCC (8.89x8.89)
  • Package / Case
    20-LCC
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    12mA, 48mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MB90F387SZPMT-GS is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High-performance: The MB90F387SZPMT-GS chip is designed to deliver high-performance computing capabilities, making it suitable for demanding applications. 2. Low power consumption: It is designed to be power-efficient, which can be advantageous in applications where energy consumption is a concern. 3. Integrated peripherals: The chip comes with various integrated peripherals such as UART, I2C, SPI, timers, and ADC, which can simplify the design and reduce the need for external components. 4. Robust communication interfaces: It supports various communication interfaces like CAN (Controller Area Network) and LIN (Local Interconnect Network), making it suitable for applications requiring reliable and efficient communication. 5. Enhanced security features: The chip may offer security features like memory protection units, secure boot, and encryption, which can be beneficial in applications where data security is crucial.Application scenarios: 1. Automotive systems: The MB90F387SZPMT-GS chip's robust communication interfaces, high-performance computing capabilities, and low power consumption make it suitable for automotive applications like engine control units, body control modules, and advanced driver-assistance systems. 2. Industrial automation: The chip's integrated peripherals, communication interfaces, and high-performance capabilities can be utilized in industrial automation applications such as programmable logic controllers (PLCs), motor control systems, and robotics. 3. Consumer electronics: The chip's power efficiency, integrated peripherals, and communication interfaces can be advantageous in consumer electronics applications like home appliances, smart devices, and IoT (Internet of Things) devices. 4. Medical devices: The chip's high-performance computing capabilities, security features, and communication interfaces can be utilized in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices. 5. Energy management systems: The chip's power efficiency, integrated peripherals, and communication interfaces can be beneficial in energy management systems like smart meters, solar inverters, and power monitoring devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to refer to the manufacturer's documentation and consult with experts for detailed information and suitability for specific applications.