74FCT3244APGG

74FCT3244APGG

Manufacturer No:

74FCT3244APGG

Description:

IC BUF NON-INVERT 3.6V 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74FCT3244APGG Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    8mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74FCT
The MB89637PF-GT-1255-BND is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89637PF-GT-1255-BND chip is designed to deliver high performance with a fast processing speed, making it suitable for applications that require quick data processing and response times. 2. Low Power Consumption: This chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Integrated Peripherals: The chip comes with various integrated peripherals such as timers, UART, I2C, SPI, and ADC, which can simplify the design process and reduce the need for additional external components. 4. Wide Operating Voltage Range: The chip can operate within a wide voltage range, allowing it to be used in different power supply environments. 5. Small Form Factor: The chip is available in a compact package, making it suitable for applications with space constraints.Application Scenarios: 1. Industrial Automation: The high performance and integrated peripherals of the chip make it suitable for industrial automation applications such as motor control, robotics, and process control systems. 2. Consumer Electronics: The low power consumption and compact form factor make the chip suitable for various consumer electronics applications, including smart home devices, wearable devices, and portable gadgets. 3. Internet of Things (IoT): The chip's low power consumption, integrated peripherals, and wide operating voltage range make it suitable for IoT applications, such as sensor nodes, smart meters, and remote monitoring systems. 4. Automotive Electronics: The chip's high performance and ability to operate in a wide voltage range make it suitable for automotive applications, including engine control units, dashboard systems, and vehicle communication modules. 5. Medical Devices: The chip's low power consumption and integrated peripherals make it suitable for medical devices such as patient monitoring systems, portable medical instruments, and diagnostic equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to refer to the manufacturer's datasheet and consult with technical experts for detailed information and suitability for specific applications.