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CY74FCT163827CPAC

CY74FCT163827CPAC

Manufacturer No:

CY74FCT163827CPAC

Description:

IC BUFF NON-INVERT 3.6V 56TSSOP

Datasheet:

Datasheet

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CY74FCT163827CPAC Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MB89663RPF-GT-141-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the 16-bit CISC architecture and offer high processing power, making them suitable for demanding applications. 2. Low Power Consumption: The chips are designed to operate efficiently with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich Peripherals: They come with a wide range of built-in peripherals such as UART, I2C, SPI, timers, and PWM, which simplifies the design process and reduces the need for external components. 4. Enhanced Security: The chips provide security features like memory protection units, code protection, and data encryption, making them suitable for applications that require secure data processing. 5. Wide Operating Temperature Range: These chips can operate reliably in a wide temperature range, making them suitable for industrial applications.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for tasks like motor control, data acquisition, and communication interfaces. 2. Automotive Electronics: They can be used in automotive applications such as engine control units, dashboard systems, and body control modules. 3. Consumer Electronics: The chips can be used in various consumer electronics devices like home appliances, gaming consoles, and audio/video equipment. 4. Internet of Things (IoT): These chips can be used in IoT devices for tasks like sensor data processing, connectivity, and control. 5. Medical Devices: They can be used in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices.Overall, the MB89663RPF-GT-141-BND integrated circuit chips offer high performance, low power consumption, and a wide range of applications, making them suitable for various industries and use cases.
CY74FCT163827CPAC Relevant information