CD74HCT367MT

CD74HCT367MT

Manufacturer No:

CD74HCT367MT

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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CD74HCT367MT Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    4mA, 4mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    2, 4 (Hex)
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    74HCT
The MB89923PF-G-195-BND is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB89923PF-G-195-BND is designed to deliver high performance with its advanced architecture and features. 2. Low Power Consumption: This IC chip is optimized for low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Compact Size: The chip's small form factor allows for easy integration into various electronic devices, including portable devices or space-constrained applications. 4. Versatility: The MB89923PF-G-195-BND offers a wide range of features and functionalities, making it suitable for diverse applications. 5. Reliability: Fujitsu is a reputable manufacturer known for producing reliable and high-quality IC chips, ensuring the reliability of the MB89923PF-G-195-BND.Application Scenarios: 1. Consumer Electronics: The MB89923PF-G-195-BND can be used in various consumer electronic devices such as smartphones, tablets, digital cameras, or portable media players. 2. Internet of Things (IoT): With its low power consumption and compact size, this IC chip can be utilized in IoT devices like smart home appliances, wearables, or sensor nodes. 3. Industrial Automation: The chip's high performance and reliability make it suitable for industrial automation applications, including control systems, robotics, or factory automation. 4. Automotive Electronics: The MB89923PF-G-195-BND can be employed in automotive electronics, such as infotainment systems, advanced driver-assistance systems (ADAS), or engine control units (ECUs). 5. Medical Devices: The chip's compact size and low power consumption make it suitable for medical devices like portable monitors, diagnostic equipment, or implantable devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or device in which the MB89923PF-G-195-BND is being used.