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MC74F657BDWR2

MC74F657BDWR2

Manufacturer No:

MC74F657BDWR2

Manufacturer:

onsemi

Description:

BUS XCVR SINGLE 8-CH 3-ST 24PIN

Datasheet:

Datasheet

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MC74F657BDWR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Voltage - Supply
    -
  • Current - Output High, Low
    -
  • Output Type
    -
  • Input Type
    -
  • Logic Type
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The DSPIC33EP32GP502-I/SO integrated circuit chips offer several advantages and can be applied in various scenarios:1. High Performance: These chips are based on the dsPIC33E core, which provides high-performance digital signal processing capabilities. They have a 70 MIPS (Million Instructions Per Second) performance, making them suitable for demanding applications.2. Enhanced Connectivity: The chips feature multiple communication interfaces such as UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices and systems. This makes them ideal for applications that require communication with external peripherals or networks.3. Rich Analog Integration: The chips include a variety of analog peripherals, including ADC (Analog-to-Digital Converter) and DAC (Digital-to-Analog Converter), which allow for precise analog signal processing. This makes them suitable for applications that require accurate measurement and control of analog signals.4. Robust Security Features: The chips offer advanced security features like CRC (Cyclic Redundancy Check) and memory protection, ensuring the integrity and confidentiality of data. This makes them suitable for applications that require secure data transmission and storage.5. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered applications or scenarios where power efficiency is crucial.Application Scenarios:1. Industrial Automation: The chips can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication with other devices on the factory floor.2. Automotive Electronics: With their high-performance capabilities and communication interfaces, the chips can be applied in automotive electronics for tasks like engine control, dashboard display, and communication with various vehicle systems.3. Medical Devices: The chips' analog integration and low power consumption make them suitable for medical devices such as patient monitoring systems, medical imaging equipment, and portable medical devices.4. Consumer Electronics: The chips can be used in consumer electronics applications like home automation systems, smart appliances, and audio/video processing.5. Power Electronics: With their high-performance DSP capabilities, the chips can be applied in power electronics applications such as power converters, inverters, and motor drives.Overall, the DSPIC33EP32GP502-I/SO integrated circuit chips offer a combination of high performance, connectivity, analog integration, and security features, making them versatile for a wide range of applications.
MC74F657BDWR2 Relevant information