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SN74LVC541ADGVR

SN74LVC541ADGVR

Manufacturer No:

SN74LVC541ADGVR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 20TVSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SN74LVC541ADGVR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TVSOP
  • Package / Case
    20-TFSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The MB90022PF-GS-422 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed communication: These chips support high-speed communication protocols, making them suitable for applications that require fast data transfer rates. 2. Low power consumption: The chips are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Robustness: The chips are designed to be robust and reliable, ensuring stable performance even in harsh environments. 4. Small form factor: The chips are compact in size, making them suitable for applications with space constraints. 5. Easy integration: The chips are designed for easy integration into existing systems, reducing development time and effort.Application scenarios: 1. Industrial automation: The chips can be used in industrial automation systems for high-speed communication between various devices, such as sensors, actuators, and controllers. 2. Robotics: The chips can be used in robotics applications for real-time communication between different components of a robot, enabling precise control and coordination. 3. Automotive: The chips can be used in automotive applications for communication between different electronic control units (ECUs) in a vehicle, enabling efficient data exchange and control. 4. Medical devices: The chips can be used in medical devices for high-speed communication between different components, such as sensors, monitors, and control units, ensuring accurate and timely data transmission. 5. Internet of Things (IoT): The chips can be used in IoT applications for communication between various IoT devices, enabling seamless connectivity and data exchange in smart homes, smart cities, and industrial IoT deployments.These are just a few examples of the advantages and application scenarios of the MB90022PF-GS-422 integrated circuit chips. The actual usage may vary depending on specific requirements and system configurations.
SN74LVC541ADGVR Relevant information