SN74LVCH162244ADL

SN74LVCH162244ADL

Manufacturer No:

SN74LVCH162244ADL

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 48SSOP

Datasheet:

Datasheet

Delivery:

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SN74LVCH162244ADL Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-SSOP
  • Package / Case
    48-BSSOP (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Current - Output High, Low
    12mA, 12mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74LVCH
The MB90591GPFR-G-137-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The chips are designed to deliver high performance with a 32-bit RISC CPU core, capable of executing instructions in a single cycle. 2. Low Power Consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Integrated Peripherals: The chips come with various integrated peripherals such as UART, I2C, SPI, timers, and GPIOs, reducing the need for external components and simplifying the overall system design. 4. Enhanced Security: The chips feature advanced security features like a memory protection unit (MPU) and a secure boot function, ensuring the integrity and confidentiality of the system. 5. Wide Operating Temperature Range: The chips can operate reliably in a wide temperature range, making them suitable for applications in harsh environments.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and robustness. 2. Internet of Things (IoT): The chips are suitable for IoT applications such as smart home devices, wearables, and sensor nodes, where low power consumption and integrated peripherals are essential. 3. Automotive Electronics: The chips can be used in automotive electronics for applications like engine control units (ECUs), body control modules (BCMs), and infotainment systems, benefiting from their high performance and security features. 4. Medical Devices: The chips can be utilized in medical devices like patient monitoring systems, portable medical instruments, and diagnostic equipment, leveraging their low power consumption and reliability. 5. Consumer Electronics: The chips can be employed in various consumer electronics products such as smart appliances, gaming consoles, and multimedia devices, taking advantage of their performance, power efficiency, and integrated peripherals.Overall, the MB90591GPFR-G-137-BND integrated circuit chips offer a combination of high performance, low power consumption, integrated peripherals, security features, and wide operating temperature range, making them suitable for a wide range of applications in different industries.