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CD74ACT241E

CD74ACT241E

Manufacturer No:

CD74ACT241E

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 20DIP

Datasheet:

Datasheet

Delivery:

Payment:

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CD74ACT241E Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-PDIP
  • Package / Case
    20-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    74ACT
The MB89943PF-G-117-BND is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89943PF-G-117-BND chip is designed to deliver high performance and efficiency, making it suitable for demanding applications. 2. Low Power Consumption: It is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Compact Size: The chip is compact in size, allowing for space-saving designs and integration into small form factor devices. 4. Integrated Features: It may include various integrated features such as analog-to-digital converters (ADC), digital-to-analog converters (DAC), timers, communication interfaces, and more, reducing the need for external components and simplifying the overall design. 5. Robustness and Reliability: The chip is designed to be robust and reliable, ensuring stable operation even in challenging environments.Application Scenarios: 1. Industrial Automation: The MB89943PF-G-117-BND chip can be used in industrial automation systems for control and monitoring purposes, providing high-performance processing capabilities and communication interfaces. 2. Internet of Things (IoT): It can be utilized in IoT devices for data acquisition, processing, and communication, enabling connectivity and intelligence in various IoT applications. 3. Consumer Electronics: The chip can be integrated into consumer electronic devices such as smart home appliances, wearables, or audio/video equipment, providing processing power and connectivity features. 4. Automotive Electronics: It can be used in automotive applications for control systems, sensor interfaces, or communication modules, providing reliable and efficient processing capabilities. 5. Medical Devices: The chip can be employed in medical devices for data acquisition, signal processing, or control functions, ensuring high performance and reliability in critical healthcare applications.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to refer to the manufacturer's documentation and consult with experts for detailed information and suitability for a particular application.
CD74ACT241E Relevant information