SN74LVTH162244DL

SN74LVTH162244DL

Manufacturer No:

SN74LVTH162244DL

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 48SSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SN74LVTH162244DL Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-SSOP
  • Package / Case
    48-BSSOP (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    12mA, 12mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74LVTH
The MB89925PF-G-193-BND is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB89925PF-G-193-BND is designed to deliver high performance with its advanced architecture and features. It may offer fast processing speeds, efficient power consumption, and reliable operation.2. Integrated Features: This IC chip may include various integrated features such as a microcontroller unit (MCU), memory, communication interfaces, analog-to-digital converters (ADC), timers, and more. These integrated features can simplify the design process, reduce component count, and save board space.3. Versatility: The MB89925PF-G-193-BND can be programmed to perform a wide range of tasks, making it suitable for various applications. Its versatility allows it to be used in different scenarios, providing flexibility to developers.Application Scenarios: 1. Industrial Automation: The high performance and integrated features of this IC chip make it suitable for industrial automation applications. It can be used to control and monitor various processes, such as robotics, motor control, sensors, and data acquisition.2. Internet of Things (IoT): With its low power consumption and integrated communication interfaces, the MB89925PF-G-193-BND can be used in IoT devices. It can enable connectivity, data processing, and control in smart home devices, wearables, environmental monitoring systems, and more.3. Consumer Electronics: This IC chip can be utilized in consumer electronics applications, including home appliances, gaming consoles, audio systems, and remote controls. Its high performance and integrated features can enhance the functionality and user experience of these devices.4. Automotive: The MB89925PF-G-193-BND may find applications in automotive systems, such as engine control units (ECUs), dashboard displays, and advanced driver-assistance systems (ADAS). Its reliability, performance, and integrated features can contribute to the efficient and safe operation of vehicles.It is important to note that the specific advantages and application scenarios of the MB89925PF-G-193-BND IC chip should be evaluated based on the detailed specifications, requirements, and compatibility with the target application.