SN74ABT162244DL
Manufacturer No:
SN74ABT162244DL
Manufacturer:
Description:
IC BUF NON-INVERT 5.5V 48SSOP
Datasheet:
Delivery:
Payment:
In Stock : 120
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SN74ABT162244DL Specifications
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TypeParameter
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Supplier Device Package48-SSOP
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Package / Case48-BSSOP (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply4.5V ~ 5.5V
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Current - Output High, Low12mA, 12mA
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Output Type3-State
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Input Type-
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Number of Bits per Element4
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Number of Elements4
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Logic TypeBuffer, Non-Inverting
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PackagingTube
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PackagingBulk
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Product StatusActive
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Series74ABT
The S6J329CLSPSC20000 integrated circuit (IC) chips, developed by Renesas Electronics Corporation, are specifically designed for automotive applications. Here are some advantages and application scenarios of these chips:Advantages: 1. High Performance: The S6J329CLSPSC20000 chips offer high processing power and performance, enabling them to handle complex automotive applications efficiently. 2. Safety and Reliability: These chips comply with the ISO 26262 functional safety standard, ensuring the highest level of safety and reliability in automotive systems. 3. Integrated Peripherals: The chips come with a wide range of integrated peripherals such as CAN, LIN, Ethernet, USB, and various communication interfaces, reducing the need for external components and simplifying system design. 4. Low Power Consumption: The chips are designed to be energy-efficient, helping to optimize power consumption in automotive systems. 5. Scalability: The S6J329CLSPSC20000 chips offer scalability, allowing for easy integration into different automotive platforms and applications.Application Scenarios: 1. Advanced Driver Assistance Systems (ADAS): These chips can be used in ADAS applications such as lane departure warning, adaptive cruise control, and collision avoidance systems, providing the necessary processing power and safety features. 2. Infotainment Systems: The chips can be utilized in automotive infotainment systems, enabling multimedia playback, connectivity features, and user interface control. 3. Body Control Modules (BCM): These chips can be employed in BCMs, which control various functions like lighting, door locks, and climate control in the vehicle. 4. Gateway Modules: The chips can be used in gateway modules that facilitate communication between different in-vehicle networks, ensuring seamless data transfer and integration. 5. Electric Vehicle (EV) Control Units: The chips can be utilized in EV control units, managing critical functions like battery management, motor control, and charging systems.Overall, the S6J329CLSPSC20000 chips offer high performance, safety, and scalability, making them suitable for a wide range of automotive applications.
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