SN74ABT16244ADL

SN74ABT16244ADL

Manufacturer No:

SN74ABT16244ADL

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 48SSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

SN74ABT16244ADL Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-SSOP
  • Package / Case
    48-BSSOP (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74ABT
The R7F7015463AFP-C#KA3 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: The R7F7015463AFP-C#KA3 chips are designed to deliver high-performance computing capabilities, making them suitable for demanding applications. 2. Low power consumption: These chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Rich peripheral set: The chips come with a wide range of built-in peripherals, such as UART, SPI, I2C, timers, and ADC, which simplifies the design process and reduces the need for external components. 4. Secure: The R7F7015463AFP-C#KA3 chips incorporate security features like encryption and tamper detection, making them suitable for applications that require data protection and secure communication. 5. Scalable: These chips are part of the Renesas Synergy Platform, which offers a scalable ecosystem of software and hardware components, enabling easy migration to higher-performance devices as the application requirements evolve.Application Scenarios: 1. Industrial automation: The R7F7015463AFP-C#KA3 chips can be used in industrial automation systems for controlling and monitoring various processes, such as robotics, motor control, and sensor interfacing. 2. Internet of Things (IoT): These chips are suitable for IoT applications, including smart home devices, wearable technology, and remote monitoring systems, where low power consumption and secure communication are essential. 3. Consumer electronics: The chips can be used in various consumer electronics products, such as smart appliances, gaming consoles, and audio/video equipment, due to their high-performance capabilities and low power consumption. 4. Automotive: The R7F7015463AFP-C#KA3 chips can be utilized in automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units, thanks to their robustness, security features, and scalability. 5. Medical devices: These chips can be employed in medical devices like patient monitoring systems, diagnostic equipment, and drug delivery systems, where reliability, low power consumption, and data security are critical.Overall, the R7F7015463AFP-C#KA3 integrated circuit chips offer high-performance computing, low power consumption, security features, and scalability, making them suitable for a wide range of applications in various industries.