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SN74LVC827APW

SN74LVC827APW

Manufacturer No:

SN74LVC827APW

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 24TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SN74LVC827APW Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-TSSOP
  • Package / Case
    24-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    74LVC
The MB89925PF-G-202-BND is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB89925PF-G-202-BND is designed to deliver high performance with its advanced architecture and features. It may offer fast processing speeds, efficient power consumption, and reliable operation.2. Integrated Features: This IC chip may include various integrated features such as a microcontroller unit (MCU), memory, communication interfaces, analog-to-digital converters (ADC), timers, and more. These integrated features can simplify the design process, reduce component count, and save board space.3. Versatility: The MB89925PF-G-202-BND can be programmed to perform a wide range of tasks, making it suitable for various applications. Its versatility allows it to be used in different scenarios, reducing the need for multiple specialized chips.4. Cost-Effective: By integrating multiple functions into a single chip, the MB89925PF-G-202-BND can potentially reduce overall system costs. It eliminates the need for additional components, simplifies the manufacturing process, and lowers the bill of materials.Application Scenarios: 1. Consumer Electronics: The MB89925PF-G-202-BND can be used in various consumer electronic devices such as smart home appliances, wearable devices, gaming consoles, and remote controls. Its high performance and integrated features make it suitable for controlling and managing different functionalities in these devices.2. Industrial Automation: This IC chip can find applications in industrial automation systems, including factory automation, robotics, and process control. Its versatility and integrated features enable it to handle tasks such as data acquisition, control algorithms, and communication interfaces.3. Internet of Things (IoT): With its low power consumption and integrated features, the MB89925PF-G-202-BND can be used in IoT devices. It can serve as a central processing unit for IoT nodes, enabling data processing, connectivity, and control functions.4. Automotive Electronics: The MB89925PF-G-202-BND may be suitable for automotive applications such as engine control units (ECUs), dashboard systems, and infotainment systems. Its high performance, reliability, and integrated features make it capable of handling complex tasks in automotive electronics.It's important to note that the specific advantages and application scenarios may vary based on the requirements and capabilities of the MB89925PF-G-202-BND chip, and it is always recommended to refer to the manufacturer's documentation and specifications for accurate information.
SN74LVC827APW Relevant information