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MC74AC541DWG

MC74AC541DWG

Manufacturer No:

MC74AC541DWG

Manufacturer:

onsemi

Description:

IC BUFFER NON-INVERT 6V 20SOIC

Datasheet:

Datasheet

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MC74AC541DWG Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    74AC
The XS1-L01A-LQ64-C4-THS integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance processing: These chips are designed to provide high-performance processing capabilities, making them suitable for applications that require fast and efficient data processing. 2. Low power consumption: The chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Flexible I/O options: The chips offer a wide range of I/O options, allowing for easy integration with various external devices and peripherals. 4. Scalability: The chips are scalable, meaning they can be easily expanded or upgraded to meet the evolving needs of the application. 5. Real-time processing: These chips are capable of real-time processing, making them suitable for applications that require immediate response and low latency.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices for data processing, sensor integration, and connectivity. 2. Audio processing: The chips can be utilized in audio processing applications such as audio effects, audio synthesis, and audio streaming. 3. Industrial automation: These chips can be employed in industrial automation systems for real-time control, data acquisition, and communication. 4. Robotics: The chips can be used in robotics applications for motor control, sensor integration, and decision-making algorithms. 5. Consumer electronics: The chips can be utilized in various consumer electronic devices such as smart home devices, wearables, and portable devices for efficient data processing and connectivity.Overall, the XS1-L01A-LQ64-C4-THS integrated circuit chips offer high-performance processing, low power consumption, and flexibility, making them suitable for a wide range of applications in different industries.
MC74AC541DWG Relevant information