MM54HCT241J/883

MM54HCT241J/883

Manufacturer No:

MM54HCT241J/883

Manufacturer:

National Semiconductor

Description:

IC BUFFER NON-INVERT 5.5V 20CDIP

Datasheet:

Datasheet

Delivery:

Payment:

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MM54HCT241J/883 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-CDIP
  • Package / Case
    20-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    7.2mA, 7.2mA
  • Output Type
    Tri-State, Non-Inverted
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    54HCT
The XS1-A10A-128-FB217-C10 integrated circuit (IC) chip is a member of the XCore XS1-A family of multicore microcontrollers developed by XMOS. Here are some advantages and application scenarios of this particular chip:Advantages: 1. Multicore architecture: The XS1-A10A-128-FB217-C10 chip features ten high-performance 32-bit processor cores, allowing for parallel processing and efficient execution of complex tasks. 2. Deterministic real-time processing: The XCore architecture provides precise timing control, making it suitable for applications that require real-time processing, such as audio and video processing, robotics, and industrial automation. 3. Low latency communication: The chip supports high-speed inter-core communication with low latency, enabling efficient coordination and synchronization between cores. 4. Flexible I/O capabilities: The XS1-A10A-128-FB217-C10 chip offers a wide range of I/O options, including digital I/O, analog inputs, and various communication interfaces like UART, SPI, and I2C, making it versatile for different application requirements. 5. Low power consumption: The XS1-A10A-128-FB217-C10 chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications.Application scenarios: 1. Audio and video processing: The XS1-A10A-128-FB217-C10 chip's multicore architecture and real-time capabilities make it ideal for applications like audio and video codecs, audio mixing, and digital signal processing. 2. Robotics and automation: The chip's parallel processing capabilities and low latency communication enable efficient control and coordination of multiple robotic systems, making it suitable for industrial automation, robotic arms, and autonomous vehicles. 3. Internet of Things (IoT): The XS1-A10A-128-FB217-C10 chip's low power consumption and flexible I/O options make it suitable for IoT applications, such as sensor nodes, smart home devices, and wearable technology. 4. Communication systems: The chip's high-speed inter-core communication and versatile I/O capabilities make it suitable for applications like network routers, software-defined radios, and wireless communication systems. 5. Embedded systems: The XS1-A10A-128-FB217-C10 chip's real-time processing capabilities and low power consumption make it suitable for various embedded systems, including industrial control systems, medical devices, and automotive electronics.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.