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CDP1857CD3

CDP1857CD3

Manufacturer No:

CDP1857CD3

Manufacturer:

Harris Corporation

Description:

IC BUFF NON-INVERT 6.5V 16SBDIP

Datasheet:

Datasheet

Delivery:

Payment:

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CDP1857CD3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SBDIP
  • Package / Case
    16-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4V ~ 6.5V
  • Current - Output High, Low
    2.3mA, 3.2mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The SPC56AP60L3BEAAR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPC56AP60L3BEAAR chips are based on the Power Architecture? technology and offer high-performance processing capabilities, making them suitable for demanding applications. 2. Enhanced Security: These chips come with advanced security features such as secure boot, secure firmware update, and cryptographic accelerators, ensuring the integrity and confidentiality of data. 3. Connectivity Options: The SPC56AP60L3BEAAR chips support various communication interfaces like CAN, LIN, FlexRay, and Ethernet, enabling seamless connectivity with other devices and systems. 4. Automotive-Grade: These chips are designed specifically for automotive applications and comply with the industry's stringent quality and reliability standards. 5. Low Power Consumption: The SPC56AP60L3BEAAR chips are optimized for low power consumption, making them suitable for battery-powered or energy-efficient applications.Application Scenarios: 1. Automotive Electronics: The SPC56AP60L3BEAAR chips are commonly used in automotive electronics applications such as engine control units (ECUs), body control modules (BCMs), advanced driver-assistance systems (ADAS), and infotainment systems. 2. Industrial Automation: These chips can be utilized in industrial automation systems for controlling and monitoring various processes, including robotics, machine control, and factory automation. 3. Smart Grids: The SPC56AP60L3BEAAR chips can be employed in smart grid applications for managing and controlling power distribution, energy monitoring, and grid communication. 4. Medical Devices: These chips can be integrated into medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices, ensuring high performance and data security. 5. Internet of Things (IoT): The SPC56AP60L3BEAAR chips can be used in IoT applications that require secure and reliable communication, such as smart home automation, asset tracking, and industrial IoT.Overall, the SPC56AP60L3BEAAR integrated circuit chips offer high performance, enhanced security, and connectivity options, making them suitable for a wide range of automotive, industrial, medical, and IoT applications.
CDP1857CD3 Relevant information